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HP HP3-X05 Exam Syllabus Topics:
| Section | Weight | Objectives |
|---|---|---|
| Topic 1: Removal & Replacement Procedures | 35% | - Disassembly and reassembly guidelines - System board, memory, and storage replacement - Display, keyboard, and internal components service |
| Topic 2: Firmware & Software Support | 10% | - Recovery procedures and OS restoration - BIOS updates and configuration |
| Topic 3: Service Best Practices | 10% | - Part identification and ordering - ESD safety and handling procedures |
| Topic 4: Troubleshooting & Diagnostics | 25% | - Component-level fault isolation - Power-on and boot issues - Hardware error codes and symptoms |
| Topic 5: Product Overview & Specifications | 20% | - Technical specifications and variants - Hardware architecture and components - HP Mini 1000/110/210 series features |



